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interconnects the ICs and other components into a system-level board to form electronic products.¡^ ³oÓ©w¸q¨Ã¨S¦³±qµ²ºc©Î¥\¯à»¡©úIC«Ê¸Ë¡A¦ý«ü¥X«Ê¸Ë¬OIC©M¹q¤l¨t²Î¸Ì¨ä¥LIC¶¡ªº¾ô¼Ù¡C§Ṳ́]¥i¥H±qºû°ò¦Ê¬ì¤W¬Ý¨ì³o¼Ëªº©w¸q¡G 3. ¡uIC«Ê¸Ë¡v¬O¦bIC´ú¸Õ¤§«eªº¨BÆJ¡A¤]¬O¥b¾ÉÅé»s³yªº³Ì«á¤@Ó¥[¤u¨BÆJ¡C¦b¥b¾ÉÅé»s³y²£·~¤¤´N¥s¥¦¡u«Ê¸Ë¡]packaging¡^¡v¡A¤]ºÙ¬°¡u¥b¾ÉÅ餸¥ó²Õ¸Ë¡]semiconductor device assembly¡^¡v©Î¬O¡u²Õ¸Ë¡]assembly¡^¡v¡A¦³®É¤]¥s°µ¡u±K«Ê¡]encapsulation or seal¡^¡v¡C¡]Integrated circuit packaging is the final stage of semiconductor device fabrication, followed by IC testing. 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Also, sometimes it is called encapsulation or seal, by the name of its last step, which might lead to confusion, because the term packaging generally comprises the steps or the technology of mounting and interconnecting of devices.¡^ ºû°ò¦Ê¬ìªº³oÓ©w¸q´N¦n¹³¦b´À§ÚÌ´yz¹Ï4¸Ì¡uIC«Ê¸Ë¡v¦b¥b¾ÉÅé»s³y²£·~Ã줤ªº¦ì¸m¡A¦ý¬O¨Ã¨S¦³¨ãÅé¹ï¡u«Ê¸Ë¡v¶i¦æ´yz¡A¤£¹L¥Ñ³Q¥¦±a¥Xªº¦UºØIC«Ê¸Ëªº§O¦W¸Ì¡A§ÚÌÁô¬ù¯à¬Ý¨ìIC«Ê¸Ëªº¦UºØ±¦V¡C ¤Wzªº´XÓ©w¸qÁöµM³£²Å¦X§Ú̲{¦b¬Ý¨ìªº¡u«Ê¸Ë¡v¡A¦ý«o¦³¡u½M¤lºN¶H¡vªº¨ý¹D¡C³o´XÓ´yz³£¨S¿ù¡A¦ý¬O³£¶È§@§½³¡´yz¡A¥¼¯à§¹¾ã»¡©ú¤°»ò¬OIC«Ê¸Ë¡C²Ä1Ó©w¸qÁ¿ªº¬O§Q¥Î¾É½u¬[°µ¥Xªº¶ì½¦«Ê¸Ë¡A¹³¬OQFP¡]quad flat package¡^©ÎSOIC¡]small outline integrated circuit¡^¤§Ãþªº«Ê¸Ë¡C²Ä2Ó©M²Ä3Ó©w¸q¤À§O»¡©ú¡u«Ê¸Ë¡v¦b¤@Ó¹q¤l¨t²Îªº¹q¸ôªO¤W¡A©Î¥b¾ÉÅé²£·~Ã줤ªº¤@Ó¬Û¹ï¦ì¸m¡A¦ü¥G©¿²¤¶i¦æ«Ê¸Ëªº¥Dn¥Øªº¬O¬°¤F«OÅ@IC¡A¤]¨S¦³»¡©ú¶i¦æIC«Ê¸Ë®Éªº¥[¤u¹Lµ{¡C¤£¹LIC«Ê¸Ëªº½T«ÜÃø©w¸q¡AÀHµÛ®É¶¡ºt¶i¡AIC«Ê¸ËÀ³¥Î¤]¤@ª½ºtÅÜ¡A¥H«e«Ê¸Ë¬O¥ý±N´¹¶ê¤À³Î¦¨¤@ÓÓ³æ¿Wªº´¹²É¡AµM«á¤~§â³æ¿Wªº´¹²É©ñ¦b«OÅ@ºc³y¤¤¡C²{¦b¡u´¹¶ê¯Å«Ê¸Ë¡v¡]wafer level packaging¡^¤w¬O²{¦b¶i¦æ¦¡¡A´¹¶ê¯Å«Ê¸Ë¤£¥²¥ý±N´¹²É±q´¹¶ê¤¤¨ú¥X¡Aª½±µ¹ï¾ãÓ´¹¶ê¶i¦æ¥[¤u¡A¨Ï±o²Ä1Ó©w¸q©úÅ㤣¾A¥Î¡C©Î³\§ÚÌ¥i¥H°Ñ¦Ò²Ä2Ó©M²Ä3Ó´yz¡A±NIC«Ê¸Ë©w¸q¬°¦b§¹¦¨´¹¶ê¼t¼Ð·Ç»sµ{«á¡A¬°¤Fn«OÅ@¿nÅé¹q¸ô¡A¦P®Én²£¥Í¤Þ¸}¡A¦Ó¹ï¿nÅé¹q¸ô¶i¦æªº¥[¤u¡A³£¥s°µ¡uIC«Ê¸Ë¡v¡C
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