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IC¦b¤j¶q¥Í²£±¡ªp¤U¤´¯à«O¦³Ã­©w¤@­Pªº«~½è¡A¦Ó¨Ï¥ÎIC»s§@ªº¹q¤l¤¸¥ó¦b¥\¯à¡B¤Ø¤o¤ÎÀ³¥Î¤W¡A¥ç¯à­ÝÅU¼Ð·Ç¤Æ¯S©Ê¡C¥i¥H³QIC¨ú¥Nªº¦UÃþ¹s¥ó¡A¤£ºÞ¬O±q¦¨¥»©Î®Ä¯à¨¤«×¨Ó¬Ý¡A´X¥G³£¤w­±Á{¬D¾Ô¡A¦Óµ´¤j¦h¼Æªºµ¥®Ä¶Ç²Î¹q¸ô¤]¤w³Q¥«³õ²^¨O¡C¤£¹L´X¤Q¦~¥ú´º¡AIC´X¥G¤w¸gµL©Ò¤£¦b¡A²{¦b¯uªÅºÞ©Î¶Ç²Î¹q´¹Åé¥u¥X²{¦b¯S®íÀ³¥Î¤è­±¡A¤é±`¥Í¬¡¨Ï¥Îªº¹q¾¹¤¤­n§ä¨ì¤£¨Ï¥ÎICªº²£«~¡A¦ü¥G¤w¤£¬O®e©öªº¨Æ¡C
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ICªºµ²ºc«D±`²Ó·L¥Bºë±K¡A¾É½u©Î¤¸¥ó¶¡¶ZÂ÷¥i¯à¬O´X­Ó·L¦Ì¡A¤]¦³¥i¯à¬O¤ñ·L¦Ì¡]£gm, 10-6m¡^ÁÙ­n¤pªºªø«×¡A¦]¦¹¥u­n¦³¨Ç³\¯»¹Ð©Î¤ô¤À¥X²{¡A³£¥i¯à§ïÅܾã­ÓICªº©Ê¯à¡A¬Æ¦Ü³y¦¨µu¸ô¡CIC³Q»s§@¦b©ö¸Hªº¥b¾ÉÅé°òªO¤W¡A¨Ò¦pª¿¡]Si, silicon¡^©Î¬O¯~¤ÆñS¡]GaAs, gallium arsenide¡^µ¥¡A­è§¹¦¨´¹¶ê»s³y¶¥¬q®É¡AICªí­±³q±`¥u¦³¤@¼h«ÜÁ¡ªº¬Á¼þª¬§÷®Æ©M¥~¬É¹jµ´¡C­Y¯Ê¥F¾A·í«OÅ@¡AIC«ÜÃø¦b¹êÅç«Ç¥~µo´§¥\¯à¡A¦]¦¹§Ú­Ì§âIC©T©w¦b¸üªO¤W¡A¦A§Q¥Î¾A·í§÷®Æ¥]ÂйF¨ì«OÅ@¨Ã¤è«K¨Ï¥Îªº¥Øªº¡A³o­Ó¹Lµ{´N¬O§Ú­Ì©Ò»¡¡uIC«Ê¸Ë¡vªº·§©À¡C¸g¹L´X¤Q¦~µo®i¡A²{¦bªºIC«Ê¸Ë¤w¤£¶È¶È¬O«OÅ@IC¡A§ó³Q­n¨D¶·¨ã¦³À°§U´²¼ö©Î¨ä¥L¥\¯à¡A¬Æ¦Ü³Q´Á«Ý¨ÓÀ°§U©µÄò¡u²öº¸©w«ß¡vªº¦³®Ä´Á­­¡C
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2. ¡u«Ê¸Ë¡v«Ø¥ßIC©M¨t²Î¡]¥D¾÷ªO¡^¶¡¾ô¼Ù¡AÅý³o­ÓIC©M¨ä¥LIC¯à¦³®ÄÁpµ²¨ó¤O¹F¨ì¹q¤l²£«~©Ò¹w´Áµo´§ªº¥\¯à¡C¡]¡§Packaging¡¨ is defined as the bridge that interconnects the ICs and other components into a system-level board to form electronic products.¡^
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3. ¡uIC«Ê¸Ë¡v¬O¦bIC´ú¸Õ¤§«eªº¨BÆJ¡A¤]¬O¥b¾ÉÅé»s³yªº³Ì«á¤@­Ó¥[¤u¨BÆJ¡C¦b¥b¾ÉÅé»s³y²£·~¤¤´N¥s¥¦¡u«Ê¸Ë¡]packaging¡^¡v¡A¤]ºÙ¬°¡u¥b¾ÉÅ餸¥ó²Õ¸Ë¡]semiconductor device assembly¡^¡v©Î¬O¡u²Õ¸Ë¡]assembly¡^¡v¡A¦³®É¤]¥s°µ¡u±K«Ê¡]encapsulation or seal¡^¡v¡C¡]Integrated circuit packaging is the final stage of semiconductor device fabrication, followed by IC testing. In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly. Also, sometimes it is called encapsulation or seal, by the name of its last step, which might lead to confusion, because the term packaging generally comprises the steps or the technology of mounting and interconnecting of devices.¡^
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